1

2

A

B

C

Not to scale

V+

GND

A0

SCL

ALERT

SDA

3

TMP108

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SBOS663A – APRIL 2013 – REVISED SEPTEMBER 2019

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5 Pin Configuration and Functions

YFF Package

6-Pin DSBGA

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

A0

B1

I

Address selection pin. Connect to GND, V+, SDA, or SCL.

ALERT

C1

O

Alert output pin

GND

A2

—

Ground

SCL

B2

I

Input clock pin

SDA

C2

I/O

Input/output data pin

V+

A1

I

Supply voltage (1.4 V to 3.6 V)

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If A0 is connected to SCL or SDA, the input voltage rating for A0 applies to SCL or SDA.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage

4

V

Input voltage

SDA and SCL(2)

–0.5

4

V

A0 and ALERT

–0.5

((V+) + 0.5) and

≤ 4

V

Operating temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000