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HT36B2 датащи(PDF) 5 Page - Holtek Semiconductor Inc |
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HT36B2 датащи(HTML) 5 Page - Holtek Semiconductor Inc |
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5 / 39 page ![]() Absolute Maximum Ratings Supply Voltage .............................VSS -0.3V to VSS+6V Storage Temperature ........................... -50°Cto125°C Input Voltage .............................VSS -0.3V to VDD+0.3V Operating Temperature .......................... -25°Cto70°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil- ity. D.C. Characteristics Ta=25 °C Symbol Parameter Test Conditions Min. Typ. Max. Unit VDD Conditions VDD Operating Voltage ¾¾ 3.6 4.5 5.5 V IDD Operating Current 4.5V No load, fOSC=11.0592MHz ¾ 16 32 mA ISTB Standby Current (WDT Disabled) 4.5V No load, System HALT ¾ 13 mA IOH I/O Ports Source Current 4.5V VOH=4.5V 5 ¾¾ mA IOL I/O Ports Sink Current 4.5V VOL=0.5V 5 ¾¾ mA VIH Input High Voltage for I/O Ports 4.5V ¾ 0.8VDD ¾ VDD V VIL Input Low Voltage for I/O Ports 4.5V ¾ 0 ¾ 0.2VDD V RPH Pull-High Resistance of I/O Ports (INT) 4.5V VIL=0V ¾ 30 ¾ k W A.C. Characteristics Ta=25 °C Symbol Parameter Test Conditions Min. Typ. Max. Unit VDD Conditions MCU Interface fOSC System Frequency 5V 11.059MHz crystal ¾ 11.059 ¾ MHz fSYS System Clock 5V ¾ 8 ¾ 12 MHz tWDT Watchdog Time-Out Period (RC) ¾ Without WDT prescaler 9 17 35 ms tRES External Reset Low Pulse Width ¾¾ 1 ¾¾ ms Symbol Parameter Figure Min. Typ. Max. Unit DAC Interface fBC DCK Bit Clock Frequency Fig 1 ¾ fSYS/16 ¾ MHz tCH DCK Bit Clock H Level Time Fig 1 600 ¾¾ ns tDOS Data Output Setup Time Fig 1 200 ¾¾ ns tDOH Data Output Hold Time Fig 1 200 ¾¾ ns tLCS Load Clock Setup Time Fig 1 200 ¾¾ ns tLCH Load Clock Hold Time Fig 1 200 ¾¾ ns HT36B2 Rev. 1.10 5 March 10, 2005 |
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