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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MCP8021 датащи(PDF) 60 Page - Microchip Technology |
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MCP8021 датащи(HTML) 60 Page - Microchip Technology |
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60 / 66 page  MCP8021/2 DS20006265D-page 60 2020-2024 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN Dimension Limits Units Center Pad Width Center Pad Length Contact Pitch Y2 X2 3.30 4.70 MILLIMETERS 0.50 BSC MIN E MAX Contact Pad Length (X38) Contact Pad Width (X38) Y1 X1 1.50 0.30 Microchip Technology Drawing C04-2424A NOM 38-Lead Thin Shrink Small Outline Package (SBX) - 4.4 mm Body [TSSOP] C Contact Pad Spacing 5.90 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: With 4.6x 3.2 mm Exposed Pad C e X2 Y2 Y1 X1 SILK SCREEN ØV EV EV |
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