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MCP8021 датащи(PDF) 54 Page - Microchip Technology |
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MCP8021 датащи(HTML) 54 Page - Microchip Technology |
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54 / 66 page ![]() MCP8021/2 DS20006265D-page 54 2020-2024 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Optional Center Pad Length Contact Pitch Y2 X2 4.70 3.20 MILLIMETERS 0.65 BSC MIN E MAX Contact Pad Length (X28) Contact Pad Width (X28) Y1 X1 1.50 0.45 NOM C Contact Pad Spacing 5.90 Contact Pad to Contact Pad (X26) G2 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Contact Pad to Center Pad (X28) G1 0.60 Microchip Technology Drawing C04-2521 Rev A 28-Lead Shrink Smal Outline Package (KEX) - 4.4 mm (.300 In.) Body [TSSOP] With 3.1x4.6 mm Exposed Pad C EV EV Y2 X2 X1 Y1 G2 E SILK SCREEN G1 ØV |
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