ADTR1107ACCZ-R7 datasheet(6/27 Pages) AD

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Data Sheet

ADTR1107

ABSOLUTE MAXIMUM RATINGS

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Rev. C | 6 of 27

Table 6.

Parameter

Rating

Transmit State (PA On), Receive State Off

VDD_PA

5.5 V

VGG_PA

−2 V to +0 V

Continuous Wave (CW) RF Input Power (RFIN) at

TX_IN

20 dBm

Continuous Power Dissipation (PDISS) (TA = 85°C,

Derate 18.98 mW/°C Above 85°C)

1.71 W

Receive State (LNA On), Transmit State Off

VDD_LNA

4 V

VGG_LNA

−2 V to +0.2 V

CW RFIN at ANT

20 dBm

PDISS (TA = 85°C, Derate 5.04 mW/°C

Above 85°C)

0.453 W

Transmit and Receive States

Output Load Voltage Standing Wave Ratio

(VSWR)

7:1

VDD_SW Range

−0.3 V to +3.6 V

VSS_SW Range

−3.6 V to +0.3 V

VDD_CTRL Range

−0.3 V to VDD + 0.3 V

Channel Temperature

175°C

Maximum Peak Reflow Temperature (Moisture

Sensitivity Level 3, MSL3)1

260°C

Storage Temperature Range

−40°C to +125°C

Operating Temperature Range

−40°C to +85°C

ESD Sensitivity (Human Body Model)

Class 1B (Passed ±500 V)

1 See the Ordering Guide section for more information.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the thermal resistance from the operating portion of the

device to the outside surface of the package (case) closest to the

device mounting area.

Table 7. Thermal Resistance

Package Type1

θJC Transmit State

θJC Receive State

Unit

CC-24-8

52.7

198.4

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board with 36 thermal vias. Refer to the JEDEC standard JESD51 for

additional information.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

SIGNAL PATH TRUTH TABLE

Table 8. Signal Path Truth Table

State

CTRL_SW

RF Signal Path

Transmit

Low

TX_IN to ANT

Receive

High

ANT to RX_OUT

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