TPS73201DBVR datasheet(23/49 Pages) TI

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7.2.3 Application Curves (continued)

10 ms/div

100 mV/div

OUT

250 mA

10 mA

OUT

= 0 mF

= 10 nF

= 39.2 kW

OUT

= 10 mF

Legacy silicon

Figure 7-9. TPS73201 Load Transient, Adjustable Version

New silicon, M3 suffix

Figure 7-10. TPS73201 Load Transient, Adjustable Version

7.3 Power Supply Recommendations

This device is designed to operate from an input voltage supply range between 1.7V and 5.5V. The input voltage

range provides adequate headroom for the device to have a regulated output. Make sure this input supply is

well regulated. If the input supply is noisy, additional input capacitors with low ESR help improve output noise

performance.

7.4 Layout

7.4.1 Layout Guidelines

To improve AC performance such as PSRR, output noise, and transient response, design the PCB with ground

plane connections for VIN and VOUT capacitors, and connect the ground plane at the GND pin of the device. In

addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device.

7.4.1.1 Thermal Considerations

Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing

the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again

enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection

circuit potentially cycles on and off. This cycling limits the dissipation of the regulator, protecting the regulator

from damage caused by overheating.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate

heat sink. For reliable operation, limit junction temperature to 125°C maximum. To estimate the margin of safety

in a complete design (including heat sink), increase the ambient temperature until the thermal protection is

triggered; use worst-case loads and signal conditions. For good reliability, thermal protection triggers at least

35°C above the maximum expected ambient condition of the application. This level produces a worst-case

junction temperature of 125°C at the highest expected ambient temperature and worst-case load.

The internal protection circuitry of the TPS732 is designed to protect against overload conditions. This circuitry is

not intended to replace proper heat sinking. Continuously running the TPS732 into thermal shutdown degrades

device reliability.

www.ti.com

TPS732

SBVS037Q – AUGUST 2003 – REVISED SEPTEMBER 2024

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