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PIC16F631 датащи(PDF) 281 Page - Microchip Technology |
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PIC16F631 датащи(HTML) 281 Page - Microchip Technology |
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281 / 294 page ![]() © 2007 Microchip Technology Inc. DS41262D-page 279 PIC16F631/677/685/687/689/690 20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 20 Pitch e 0.50 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E 4.00 BSC Exposed Pad Width E2 2.60 2.70 2.80 Overall Length D 4.00 BSC Exposed Pad Length D2 2.60 2.70 2.80 Contact Width b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 – – D EXPOSED PAD E E2 2 1 N TOP VIEW NOTE 1 N L K b e D2 2 1 A A1 A3 BOTTOM VIEW Microchip Technology Drawing C04-126B |
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