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PIC16F631 датащи(PDF) 280 Page - Microchip Technology |
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PIC16F631 датащи(HTML) 280 Page - Microchip Technology |
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280 / 294 page ![]() PIC16F631/677/685/687/689/690 DS41262D-page 278 © 2007 Microchip Technology Inc. 20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 20 Pitch e 0.65 BSC Overall Height A – – 2.00 Molded Package Thickness A2 1.65 1.75 1.85 Standoff A1 0.05 – – Overall Width E 7.40 7.80 8.20 Molded Package Width E1 5.00 5.30 5.60 Overall Length D 6.90 7.20 7.50 Foot Length L 0.55 0.75 0.95 Footprint L1 1.25 REF Lead Thickness c 0.09 – 0.25 Foot Angle φ 0° 4° 8° Lead Width b 0.22 – 0.38 φ L L1 A2 c e b A1 A 12 NOTE 1 E1 E D N Microchip Technology Drawing C04-072B |
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