MCP23008-ESLASHML datasheet(41/44 Pages) MICROCHIP

41 / 44 page

DS21919D-page 41

MCP23008/MCP23S08

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Device

MCP23008:

8-Bit I/O Expander w/ I2C™ Interface

MCP23008T:

8-Bit I/O Expander w/ I2C Interface

(Tape and Reel)

MCP23S08:

8-Bit I/O Expander w/ SPI Interface

MCP23S08T:

8-Bit I/O Expander w/ SPI Interface

(Tape and Reel)

Temperature

Range

-40

°C to +125°C (Extended) *

* While these devices are only offered in the “E”

temperature range, the device will operate at different

voltages and temperatures as identified in the

Section 2.0 “Electrical Characteristics”.

Package

Plastic Quad Flat, No Lead Package

4x4x0.9 mm Body (QFN), 20-Lead

Plastic DIP (300 mil Body), 18-Lead

Plastic SOIC (300 mil Body), 18-Lead

SSOP, (209 mil Body, 5.30 mm), 20-Lead

PART NO.

/XX

Package

Temperature

Range

Device

Examples:

MCP23008-E/P:

Extended Temp.,

18LD PDIP package.

MCP23008-E/SO: Extended Temp.,

18LD SOIC package.

MCP23008T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

MCP23008-E/SS:

Extended Temp.,

20LD SSOP package.

MCP23008T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

MCP23008-E/ML: Extended Temp.,

20LD QFN package.

MCP23S08-E/P:

Extended Temp.,

18LD PDIP package.

MCP23S08-E/SO: Extended Temp.,

18LD SOIC package.

MCP23S08T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

MCP23S08-E/SS: Extended Temp.,

20LD SSOP package.

MCP23S08T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

MCP23S08T-E/MF: Tape and Reel,

Extended Temp.,

20LD QFN package.

–

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