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MCP23008-E/ML датащи(PDF) 33 Page - Microchip Technology |
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MCP23008-E/ML датащи(HTML) 33 Page - Microchip Technology |
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33 / 44 page ![]() © 2007 Microchip Technology Inc. DS21919D-page 33 MCP23008/MCP23S08 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 18-Lead PDIP (300 mil) 18-Lead SOIC (300 mil) 20-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example: Example: Example: MCP23008 0634256 MCP23008-E/P^^ 0634256 XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN MCP23S08 XXXXXXXXXXXX 0634256 E/SO^^ E/SS^^ Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e 20-Lead QFN Example XXXXX XXXXXX XXXXXX YWWNNN 23S08 E/ML^^ 0637 256 3 e |
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