MCP23008-ESLASHML datasheet(29/44 Pages) MICROCHIP

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DS21919D-page 29

MCP23008/MCP23S08

FIGURE 2-6:

SPI OUTPUT TIMING

SCK

MSb out

LSb out

don’t care

Mode 1,1

Mode 0,0

TABLE 2-3:

SPI INTERFACE AC CHARACTERISTICS

SPI Interface AC Characteristics

Operating Conditions (unless otherwise indicated):

1.8V

≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +85°C (I-Temp)

4.5V

≤ VDD ≤ 5.5V at -40°C ≤ TA ≤ +125°C (E-Temp) (Note 1)

Param

No.

Characteristic

Sym

Min

Typ

Max

Units

Conditions

Clock Frequency

FCLK

—

MHz

1.8V – 5.5V (I-Temp)

—

MHz

2.7V – 5.5V (I-Temp)

—

MHz

4.5V – 5.5V (E-Temp)

1CS Setup Time

TCSS

—

2CS Hold Time

TCSH

100

—

1.8V – 5.5V (I-Temp)

—

2.7V – 5.5V (I-Temp)

—

4.5V – 5.5V (E-Temp)

3CS Disable Time

TCSD

100

—

1.8V – 5.5V (I-Temp)

—

2.7V – 5.5V (I-Temp)

—

4.5V – 5.5V (E-Temp)

Data Setup Time

TSU

—

1.8V – 5.5V (I-Temp)

—

2.7V – 5.5V (I-Temp)

—

4.5V – 5.5V (E-Temp)

Data Hold Time

THD

—

1.8V – 5.5V (I-Temp)

—

2.7V – 5.5V (I-Temp)

—

4.5V – 5.5V (E-Temp)

CLK Rise Time

——

µs

Note 1

CLK Fall Time

——

µs

Note 1

Clock High Time

THI

—

1.8V – 5.5V (I-Temp)

—

2.7V – 5.5V (I-Temp)

—

4.5V – 5.5V (E-Temp)

Note 1: This parameter is characterized, not 100% tested.

2: TV = 90 ns (max) when address pointer rolls over from address 0x0A to 0x00.

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