Product Specification

SL1 ICS31 01

Rev. 1.2

July 2000

Page 5 of 22

Public

3 Scope

This specification describes the electrical, physical and dimensional properties of unsawn and sawn

base for delivery of tested I•CODE1 Label ICs.

General recommendations are given for storage, handling and processing of wafers as well as

assembly of labels.

Reference documents:

MIL-STD 883D Method 3023

MIL-STD 883D Method 3015

SNW-FQ-627

PICTOH-QS007

General Specification for 6” Wafer

General Quality Specification

I•CODE Label IC, Coil Design Guide

This product specification is valid for mask revision: VCOL1V0

NK: O

MB: B

4 Ordering Information

Following ordering options are available:

Type Name

Description

Ordering Code

SL1 ICS31 01W/N5D

Sawn wafer on foil (FFC), 150 µm, inked and mapped

9352 670 53005

SL1 ICS31 01U/N5D

Unsawn wafer, 150 µm, inked and mapped

9352 670 50025

SL1 ICS31 01U/L6D

Unsawn wafer, 525 µm, mapped (not inked)

9352 670 59025