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TMG3992 датащи(PDF) 89 Page - OSRAM GmbH

номер детали TMG3992
подробное описание детали  Gesture, Color, ALS, and Proximity Sensor Module with mobeam™ Barcode Emulation
PDF  96 Pages
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производитель  OSRAM [OSRAM GmbH]
домашняя страница  http://www.osram.com
Logo OSRAM - OSRAM GmbH

TMG3992 датащи(HTML) 89 Page - OSRAM GmbH

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[v1-06] 2018-Feb-27
TMG3992 − Soldering & Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping. Devices are dry packed in a sealed
aluminized envelope called a moisture-barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: < 40
°C
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the allow-
able moisture region.
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the follow-
ing conditions:
• Floor Life: 168 hours
• Ambient Temperature: < 30°C
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, re-
bake at 50
°C for 12 hours.



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