TMF8805 datasheet(70/74 Pages) OSRAM

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TMF8805 датащи(PDF) 70 Page - OSRAM GmbH

70 / 74 page

TMF8805

Soldering & storage information

Datasheet

• PUBLIC • Document Feedback

DS000692

• v7-00 • 2023-Dec-01

70 / 74

Soldering & storage information

10.1

Soldering information

The package has been tested and has demonstrated an ability to be reflow soldered to a PCB

substrate. The process, equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat exposure of components

during the solder reflow process of product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum of three passes through this

solder reflow profile.

Figure 18: Solder reflow profile graph

Table 111: Solder reflow profile

Parameter

Reference

Device

Average temperature gradient in preheating

2.5 °C/s

Soak time

tsoak

2 to 3 minutes

Time above 217 °C (T1)

Max 60 s

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