TCS34005FN datasheet(29/35 Pages) OSRAM

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[v2-00] 2023-Feb-09

TCS3400 − Soldering & Storage Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of

absorbed moisture possible, each device is baked prior to being

dry packed for shipping.

Devices are dry packed in a sealed aluminized envelope called

a moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 24 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 24 months

• Ambient Temperature: < 40

°C

• Relative Humidity: < 90%

Rebaking of the devices will be required if the devices exceed

the 24 months shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

Floor Life

The FN package has been assigned a moisture sensitivity level

of MSL 3. As a result, the floor life of devices removed from the

moisture barrier bag is 168 hours from the time the bag was

opened, provided that the devices are stored under the

following conditions:

• Floor Life: 168 hours

• Ambient Temperature:

< 30°C

• Relative Humidity:

< 60%

If the floor life or the temperature/humidity conditions have

been exceeded, the devices must be rebaked prior to solder

reflow or dry packing.

Rebaking Instructions

When the shelf life or floor life limits have been exceeded,

rebake at 50

°C for 12 hours.

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