L800BT90VC datasheet(49/49 Pages) AMD

49 / 49 page

Am29LV800B

AC Characteristics—Figure 17. Program

Operations Timing and Figure 18.

Chip/Sector Erase Operations

Deleted tGHWL and changed OE# waveform to start at

high.

Physical Dimensions

Replaced figures with more detailed illustrations.

Revision G+1 (July 7, 2000)

Ordering Information

Inserted dashes into ordering part numbers. Deleted

burn-in option.

Revision G+2 (August 14, 2000)

Global

Deleted 70R and 80 ns speed options and burn-in

option.

Revision G+3 (June 4, 2004)

Ordering Information

Added Lead-free (Pb-free) options to the Tempera-

ture range breakout of the OPN table and to the Valid

Combinations table.

Revision G+4 (January 20, 2005)

Added migration statement to cover page and first

page of data sheet.

Added Colophon.

Updated Trademark

Revision G+5 (May 25, 2005)

Updated migration statement on cover page and first

page of data sheet.

Updated trademarks.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary

industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that

includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal

injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,

medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and

artificial satellite). Please note that Spansion LLC will not be liable to you and/or any third party for any claims or damages arising in connection with above-

mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such

failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels

and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on

export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,

the prior authorization by the respective government entity will be required for export of those products.

Trademarks

Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only

and may be trademarks of their respective companies

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