M25P16 datasheet(53/55 Pages) STMICROELECTRONICS

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M25P16

Revision history

53/55

Revision history

Table 24.

Document revision history

Date

Revision

Changes

16-Jan-2002

0.1

Target Specification Document written

23-Apr-2002

0.4

Clarification of descriptions of entering Stand-by Power mode from Deep

Power-down mode, and of terminating an instruction sequence or data-

out sequence.

ICC2(max) value changed to 10µA

13-Dec-2002

0.5

Typical Page Program time improved. Write Protect setup and hold times

specified, for applications that switch Write Protect to exit the Hardware

Protection mode immediately before a WRSR, and to enter the Hardware

Protection mode again immediately after

15-May-2003

0.6

MLP8 package added

0.7

50MHz operation, and RDID instruction added. Published internally, only

20-Jun-2003

0.8

8x6 MLP8 and SO16(300 mil) packages added

24-Sep-2003

1.0

tPP, tSE and tBE revised. SO16 package code changed. Output Timing

Reference Voltage changed. Document promoted to Preliminary Data.

24-Nov-2003

2.0

Table of contents, warning about exposed paddle on MLP8, and Pb-free

options added.

Value of tVSL(min) and tBE(typ) changed. Change of naming for VDFPN8

packages. Document promoted to full Datasheet.

17-May-2004

3.0

MLP8(5x6) package removed. Soldering temperature information

clarified for RoHS compliant devices. Device Grade clarified

01-Apr-2005

4.0

Notes 1 and 2 removed from Table 23: Ordering information scheme.

Small text changes.

Read Identification (RDID), Deep Power-down (DP) and Release from

Deep Power-down and Read Electronic Signature (RES) instructions,

and Active Power, Stand-by Power and Deep Power-Down modes

paragraph clarified.

01-Aug-2005

5.0

Updated Page Program (PP) instructions in Page programming, Page

Program (PP) and Table 15: AC characteristics (Grade 6).

20-Oct-2005

6.0

VFQFPN8 package added (see Figure 27: VFQFPN8 (MLP8) 8-lead Very

thin Fine Pitch Quad Flat Package No lead, 6 × 5 mm, package outline

and Table 18: VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Quad Flat

Package No lead, 6 × 5 mm, package mechanical data).

All packages are ECOPACK®. “Blank” option removed under Plating

Technology.

27-Feb-2006

SO8 Narrow and SO8 Wide packages added (see Section 11: Package

mechanical). VDFPN8 package updated (see Table 19: VDFPN8 (MLP8)

8-lead Very thin Dual Flat Package No lead, 8 × 6mm, package

mechanical data). Note 1 added to Table 23: Ordering information

scheme.

04-Jul-2006

Figure 4: Bus master and memory devices on the SPI bus updated and

Note 2 added. SO8N package specifications updated (see Figure 29 and

Table 20). Small text changes.

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