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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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CC1021-RTR1 датащи(PDF) 87 Page - Texas Instruments |
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CC1021-RTR1 датащи(HTML) 87 Page - Texas Instruments |
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87 / 92 page  CC1021 SWRS045 Page 87 of 91 27.2. Recommended PCB Footprint for Package (QFN 32) Note: The figure is an illustration only and not to scale. There are nine 14 mil (0.36 mm) diameter via holes distributed symmetrically in the ground plane under the package. See also the CC1020EMX reference design. 27.3. Package Thermal Properties Thermal resistance Air velocity [m/s] 0 1 2 Rth,j-a [K/W] 21.4 18.9 17.0 27.4. Soldering Information Recommended soldering profile for both standard leaded packages and Pb-free packages is according to IPC/JEDEC J-STD-020C. |
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