RECOMMENDED LAND PATTERN

Microchip Technology Drawing C04-2057-SWB Rev E

8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2017 Microchip Technology Inc.

R

Dimension Limits

Units

C

Contact Pad Spacing

Contact Pitch

MILLIMETERS

1.27 BSC

MIN

E

MAX

5.40

Contact Pad Length (X8)

Contact Pad Width (X8)

Y1

X1

1.55

0.60

NOM

E

X1

C

Y1

SILK SCREEN

Atmel Legacy Global Package Code SWB

ATECC608B

Package Drawings

© 2020 Microchip Technology Inc.

Summary Datasheet

DS40002239A-page 17