For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2017 Microchip Technology Inc.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Microchip Technology Drawing C04-21303 Rev A Sheet 2 of 2

3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact]

Atmel Legacy Global Package Code RHB

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Pitch

Standoff

Units

Dimension Limits

A1

A

b

e

L

E

N

2.00 BSC

2.10

1.60

0.45

0.00

1.70

2.20

0.50

0.02

2.50 BSC

MILLIMETERS

MIN

NOM

3

2.30

1.80

0.55

0.05

MAX

K

0.30 REF

Terminal-to-Terminal Spacing

Overall Length

D

6.50 BSC

f

0.40

0.30

0.50

Package Edge to Terminal Edge

g

0.15

0.05

0.25

Package Edge to Terminal Edge

ATECC608B

Package Drawings

© 2020 Microchip Technology Inc.

Summary Datasheet

DS40002239A-page 22