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AD8385ASVZ датащи(PDF) 22 Page - Analog Devices

номер детали AD8385ASVZ
подробное описание детали  10-Bit, 12-Channel Decimating LCD DECDRIVER with Level Shifters
PDF  24 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

AD8385ASVZ датащи(HTML) 22 Page - Analog Devices

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AD8385
Rev. 0 | Page 22 of 24
16 mm
6.5 mm
AD8385 PCB DESIGN RECOMMENDATIONS
Top PCB Layer
•
Pad size: 0.25 mm × 0.25 mm
•
Pad pitch: 0.5 mm
•
Thermal pad size: 6.5 mm × 6.5 mm
•
Thermal via structure: 0.25 mm diameter vias on a
0.5 mm grid
Bottom PCB Layer
It is recommended that the bottom thermal pad be thermally
connected to a plane. The connection should be direct such that
the thermal pad becomes part of the plane.
Figure 22. Land Pattern—Top Layer
The use of thermal spokes is not recommended when con-
necting the thermal pads or via structure to the AVCC plane.
6.5 mm
Solder Masking
To minimize the formation of solder voids due to solder flowing
into the via holes (solder wicking), the via diameter should be
small. Optional solder masking of the via holes on the top layer
of the PCB plugs the via holes, inhibiting solder flow into the
holes. To optimize the thermal pad coverage, the solder mask
diameter should be no more than 0.1 mm larger than the via
hole diameter.
Solder Mask—Top Layer
•
Pads: Set by the customer’s PCB design rules
•
Thermal vias: 0.25 mm diameter circular mask, centered
on the vias.
Figure 23. Land Pattern—Bottom Layer
Solder Mask—Bottom Layer
Set by the customer’s PCB design rules.
Figure 24. Solder Mask—Top Layer



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