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BSP250 датащи(PDF) 4 Page - NXP Semiconductors

номер детали BSP250
подробное описание детали  P-channel enhancement mode vertical D-MOS transistor
PDF  12 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BSP250 датащи(HTML) 4 Page - NXP Semiconductors

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1997 Jun 20
4
Philips Semiconductors
Product specification
P-channel enhancement mode
vertical D-MOS transistor
BSP250
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy printed-circuit board, 40
× 40 × 1.5 mm; mounting pad for drain lead minimum 6 cm2.
CHARACTERISTICS
Tj =25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
note 1
75
K/W
Rth j-s
thermal resistance from junction to soldering point
10
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V(BR)DSS
drain-source breakdown voltage
VGS = 0; ID = −10 µA
−30
−−
V
VGSth
gate-source threshold voltage
VGS =VDS; ID = −1mA
−1
−−2.8
V
IDSS
drain-source leakage current
VGS = 0; VDS = −24 V
−−−100
nA
IGSS
gate leakage current
VGS = ±20 V; VDS =0
−−±100
nA
IDon
on-state drain current
VGS = −10 V; VDS = −1V
−3
−−
A
VGS = −4.5 V; VDS = −5V
−1
−−
A
RDSon
drain-source on-state resistance
VGS = −4.5 V; ID = −0.5 A
0.33
0.4
VGS = −10 V; ID = −1A
0.22
0.25
y
fs
forward transfer admittance
VDS = −20 V; ID = −1A
1
2
S
Ciss
input capacitance
VGS = 0; VDS = −20 V; f = 1 MHz −
250
pF
Coss
output capacitance
VGS = 0; VDS = −20 V; f = 1 MHz −
140
pF
Crss
reverse transfer capacitance
VGS = 0; VDS = −20 V; f = 1 MHz −
50
pF
QG
total gate charge
VGS = −10 V; VDS = −15 V;
ID = −2.3 A
10
25
nC
QGS
gate-source charge
VGS = −10 V; VDS = −15 V;
ID = −2.3 A
1
nC
QGD
gate-drain charge
VGS = −10 V; VDS = −15 V;
ID = −2.3 A
3
nC
Switching times
ton
turn-on time
VGS =0to −10 V; VDD = −20 V;
ID = −1 A; RL =20 Ω
20
80
ns
toff
turn-off time
VGS = −10 to 0 V; VDD = −20 V;
ID = −1 A; RL =20 Ω
50
140
ns
Source-drain diode
VSD
source-drain diode forward voltage
VGD = 0; IS = −1.25 A
−−−1.6
V
trr
reverse recovery time
IS = −1.25 A; di/dt = 100 A/µs
150
200
ns



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