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BSP250 датащи(PDF) 4 Page - NXP Semiconductors |
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BSP250 датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 12 page ![]() 1997 Jun 20 4 Philips Semiconductors Product specification P-channel enhancement mode vertical D-MOS transistor BSP250 THERMAL CHARACTERISTICS Note 1. Device mounted on an epoxy printed-circuit board, 40 × 40 × 1.5 mm; mounting pad for drain lead minimum 6 cm2. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 75 K/W Rth j-s thermal resistance from junction to soldering point 10 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID = −10 µA −30 −− V VGSth gate-source threshold voltage VGS =VDS; ID = −1mA −1 −−2.8 V IDSS drain-source leakage current VGS = 0; VDS = −24 V −−−100 nA IGSS gate leakage current VGS = ±20 V; VDS =0 −−±100 nA IDon on-state drain current VGS = −10 V; VDS = −1V −3 −− A VGS = −4.5 V; VDS = −5V −1 −− A RDSon drain-source on-state resistance VGS = −4.5 V; ID = −0.5 A − 0.33 0.4 Ω VGS = −10 V; ID = −1A − 0.22 0.25 Ω y fs forward transfer admittance VDS = −20 V; ID = −1A 1 2 − S Ciss input capacitance VGS = 0; VDS = −20 V; f = 1 MHz − 250 − pF Coss output capacitance VGS = 0; VDS = −20 V; f = 1 MHz − 140 − pF Crss reverse transfer capacitance VGS = 0; VDS = −20 V; f = 1 MHz − 50 − pF QG total gate charge VGS = −10 V; VDS = −15 V; ID = −2.3 A − 10 25 nC QGS gate-source charge VGS = −10 V; VDS = −15 V; ID = −2.3 A − 1 − nC QGD gate-drain charge VGS = −10 V; VDS = −15 V; ID = −2.3 A − 3 − nC Switching times ton turn-on time VGS =0to −10 V; VDD = −20 V; ID = −1 A; RL =20 Ω − 20 80 ns toff turn-off time VGS = −10 to 0 V; VDD = −20 V; ID = −1 A; RL =20 Ω − 50 140 ns Source-drain diode VSD source-drain diode forward voltage VGD = 0; IS = −1.25 A −−−1.6 V trr reverse recovery time IS = −1.25 A; di/dt = 100 A/µs − 150 200 ns |
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