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BSP250 датащи(PDF) 3 Page - NXP Semiconductors |
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BSP250 датащи(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1997 Jun 20 3 Philips Semiconductors Product specification P-channel enhancement mode vertical D-MOS transistor BSP250 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. Pulse width and duty cycle limited by maximum junction temperature. 2. Device mounted on an epoxy printed-circuit board, 40 × 40 × 1.5 mm; mounting pad for drain lead minimum 6 cm2. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage (DC) −−30 V VGSO gate-source voltage (DC) open drain −±20 V ID drain current (DC) Ts ≤ 100 °C −−3A IDM peak drain current note 1 −−12 A Ptot total power dissipation Ts = 100 °C − 5W Tamb =25 °C; note 2 − 1.65 W Tstg storage temperature −65 +150 °C Tj operating junction temperature − 150 °C Source-drain diode IS source current (DC) Ts ≤ 100 °C −−1.5 A ISM peak pulsed source current note 1 −−6A Fig.2 Power derating curve. handbook, halfpage 0 200 2.0 0 0.4 0.8 1.2 1.6 MLB885 Tamb (°C) 50 100 150 Ptot (W) δ = 0.01. Soldering point temperature Ts = 100 °C. (1) RDSon limitation. Fig.3 SOAR. handbook, halfpage MLB835 VDS (V) ID (A) −10−1 −102 −1 −10 −10−2 −102 −10−1 −1 −10 tp tp T P t T δ = 1 ms DC (1) tp = 10 µs |
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