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BLF522 датащи(PDF) 3 Page - NXP Semiconductors |
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BLF522 датащи(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() September 1992 3 Philips Semiconductors Product specification UHF power MOS transistor BLF522 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage − 40 V ±VGS gate-source voltage − 20 V ID DC drain current − 1.8 A Ptot total power dissipation up to Tmb =25 °C − 20 W Tstg storage temperature −65 150 °C Ti junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE Rth j-mb thermal resistance from junction to mounting base Tmb =25 °C; Ptot = 20 W 8.8 K/W Rth mb-h thermal resistance from mounting base to heatsink Tmb =25 °C; Ptot = 20 W 0.4 K/W Fig.2 DC SOAR. (1) Current in this area may be limited by RDS(on). (2) Tmb =25 °C. handbook, halfpage 0.1 1 1 10 100 5 ID (A) VDS (V) MRA990 (2) (1) Fig.3 Power/temperature derating curves. (1) Continuous operation. (2) Short-time operation during mismatch. handbook, halfpage 0 5 10 15 20 (2) 25 30 35 0 20 40 60 80 100 120 MRA427 Ptot (W) Th ( oC) (1) |
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