BLC10G22XS-401AVT

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© Ampleon Netherlands B.V. 2022. All rights reserved.

Product data sheet

Rev. 1 — 20 May 2022

6 of 14

BLC10G22XS-401AVT

Power LDMOS transistor

7.3 Test circuit

Printed-Circuit Board (PCB): Rogers RO4350B;



r = 3.5; thickness = 0.508 mm; thickness copper

plating = 35

m.

See Table 11 for a list of components.

Fig 2.

Component layout

C15

C24

C20

C21

C3

C4

C5

R1

C11

R2

C12

C18

C1

C22

C25

C2

C9

C10

C6

X1

C14

R3

C19

C13

C8

C7

C17

C23

C16

109.9 mm

80 mm

amp01766

Table 11.

List of components

For test circuit see Figure 2.

Component

Description

Value

Remarks

C1, C2, C3, C4, C5,

C6, C7, C8, C9, C10

multilayer ceramic chip capacitor 10

F, 100 V

Murata: GRM32EC72A106KE05L, SMD 1210

C11, C12, C13, C14,

C15, C16, C17

multilayer ceramic chip capacitor 10 pF

Murata: GQM21 Hi-Q 250V series, SMD 0805

C18, C22, C23

multilayer ceramic chip capacitor 0.5 pF

Murata: GQM21 Hi-Q 250V series, SMD 0805

C19

multilayer ceramic chip capacitor 0.7 pF

Murata: GQM21 Hi-Q 250V series, SMD 0805

C20, C21

multilayer ceramic chip capacitor 3.3 pF

Murata: GQM21 Hi-Q 250V series, SMD 0805

C24, C25

electrolytic capacitor

470

F, 63 V

Panasonic: EEVFK1J471M

R1

resistor

50

, 8 W

Anaren: C8A50Z4B

R2, R3

resistor

5.1

, 1 %

SMD 0603

X1

hybrid coupler

2 dB, 90



Anaren: X3C20F1-02S