ISL70417SEH

FN7962 Rev.5.00

Page 21 of 22

Oct 24, 2019

Package Outline Drawing

Ceramic Metal Seal Flatpack Packages (Flatpack)

NOTES:

1. Index area: A notch or a pin one identification mark shall be located

adjacent to pin one and shall be located within the shaded area

shown. The manufacturer’s identification shall not be used as a pin

one identification mark. Alternately, a tab (dimension k) may be

used to identify pin one.

2. If a pin one identification mark is used in addition to a tab, the limits

of dimension k do not apply.

3. This dimension allows for off-center lid, meniscus, and glass over-

run.

4. Dimensions b1 and c1 apply to lead base metal only. Dimension M

applies to lead plating and finish thickness. The maximum limits of

lead dimensions b and c or M shall be measured at the centroid of

the finished lead surfaces, when solder dip or tin plate lead finish is

applied.

5. N is the maximum number of terminal positions.

6. Measure dimension S1 at all four corners.

7. For bottom-brazed lead packages, no organic or polymeric materi-

als shall be molded to the bottom of the package to cover the leads.

8. Dimension Q shall be measured at the point of exit (beyond the me-

niscus) of the lead from the body. Dimension Q minimum shall be

reduced by 0.0015 inch (0.038mm) maximum when solder dip lead

finish is applied.

9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

10. Controlling dimension: INCH.

-D-

-C-

0.004

H A - B

M

D

S

S

-A-

-B-

0.036

H A - B

M

D

S

S

e

E

A

Q

L

D

A

E1

SEATING AND

L

E2

E3

E3

BASE PLANE

-H-

b

C

S1

M

c1

b1

(c)

(b)

SECTION A-A

BASE

LEAD FINISH

METAL

PIN NO. 1

ID AREA

A

M

K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B)

14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.045

0.115

1.14

2.92

-

b

0.015

0.022

0.38

0.56

-

b1

0.015

0.019

0.38

0.48

-

c

0.004

0.009

0.10

0.23

-

c1

0.004

0.006

0.10

0.15

-

D

-

0.390

-

9.91

3

E

0.235

0.260

5.97

6.60

-

E1

-0.290

-7.11

3

E2

0.125

-

3.18

-

-

E3

0.030

-

0.76

-

7

e

0.050 BSC

1.27 BSC

-

k

0.008

0.015

0.20

0.38

2

L

0.270

0.370

6.86

9.40

-

Q

0.026

0.045

0.66

1.14

8

S1

0.005

-

0.13

-

6

M

-

0.0015

-

0.04

-

N14

14

-

Rev. 0 5/18/94

For the most recent package outline drawing, see K14.A.