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S12SCIV3/D датащи(PDF) 6 Page - NXP Semiconductors

номер детали S12SCIV3/D
подробное описание детали  The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core
PDF  98 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
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SoC Guide — MC9S12KG128 V01.01
Section 13 OSC Block Description
Section 14 Port Integration Module (PIM) Block Description
Section 15 Pulse Width Modulator (PWM) Block Description
Section 16 Serial Communications Interface (SCI) Block Description
Section 17 Serial Peripheral Interface (SPI) Block Description
Section 18 Timer (TIM) Block Description
Section 19 Voltage Regulator (VREG) Block Description
19.1
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
19.1.1
VDD1, VDD2, VSS1, VSS2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
19.1.2
Recommended PCB Layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Appendix A Electrical Characteristics
A.1
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
A.1.1
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
A.1.2
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
A.1.3
Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
A.1.4
Current Injection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
A.1.5
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
A.1.6
ESD Protection and Latch-up Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
A.1.7
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
A.1.8
Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 61
A.1.9
I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
A.1.10
Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
A.2
ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
A.2.1
ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
A.2.2
Factors influencing accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
A.2.3
ATD accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
A.3
NVM, Flash and EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
A.3.1
NVM timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
A.3.2
NVM Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
A.4
Reset, Oscillator and PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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