FN3325 Rev 0.00

Page 9 of 9

December 1992

CD4076BMS

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FIGURE 11. FUNCTIONAL WAVEFORM

tPHZ

VDD

VSS

VDD

VOL

VOH

VSS

50%

90%

10%

50%

tPZH

10%

90%

tPZL

tPLZ

Q OUTPUT

Q OUTPUT

OUTPUT DISABLE

CHARACTER

TEST

VOLTAGE

AT D

AT Q

tPHZ

VDD

VSS

tPLZ

VSS

VDD

tPZL

VSS

VDD

tPZH

VDD

VSS

Chip Dimensions and Pad Layout

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

as indicated. Grid graduations are in mils (10-3 inch)