CD4069UBMS

FN3321 Rev 0.00

Page 8 of 8

December 1992

Chip Dimensions and Pad Layout

Dimension in parenthesis are in millimeters and are derived

from the basic inch dimensions as indicated. Grid graduations

are in mils (10-3 inch).

METALLIZATION: Thickness: 11k

Å 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6k

Å, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches

FIGURE 15. HIGH-INPUT IMPEDANCE AMPLIFIER

FIGURE 16. TYPICAL RC OSCILLATOR CIRCUIT

FIGURE 17. TYPICAL CRYSTAL OSCILLATOR CIRCUIT

FIGURE 18. INPUT PULSE SHAPING CIRCUIT

(SCHMITT TRIGGER)

1/6 CD4069

IN

OUT

Rf

 10 MEG

1/3 CD4069

RT

RS

CT

FOR TYPICAL COMPONENT

VALUES AND CIRCUIT PERFORMANCE,

SEE APPLICATION NOTE AN-6466

1/6 CD4069

Rf

XTAL

RS

CT

CS

FOR TYPICAL COMPONENT

VALUES AND CIRCUIT

PERFORMANCE, SEE

APPLICATION NOTES:

AN-6086 AND AN-6539

1/3 CD4069

Rf

IN

OUT

RS

UPPER SWITCHING POINT

RS + Rf

VP



Rf

VDD

2

LOWER SWITCHING POINT

VN



Rf - RS

Rf

Rf > RS

VDD

2





1

2

3

4

5

6

8

7

910

11

12

14

13

DIE SIZE:

48 X 48 (45 - 53)

(1.143 - 1.346)