FN3321 Rev 0.00

Page 5 of 8

December 1992

CD4069UBMS

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TABLE 7. TOTAL DOSE IRRADIATION

CONFORMANCE GROUPS

MIL-STD-883

METHOD

TEST

READ AND RECORD

PRE-IRRAD

POST-IRRAD

PRE-IRRAD

POST-IRRAD

Group E Subgroup 2

5005

1, 7, 9

Table 4

1, 9

Table 4

TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS

FUNCTION

OPEN

GROUND

VDD

9V

 -0.5V

OSCILLATOR

50kHz

25kHz

Static Burn-In 1

(Note 1)

2, 4, 6, 8, 10, 12

1, 3, 5, 7, 9, 11,

13

14

Static Burn-In 2

(Note 1)

2, 4, 6, 8, 10, 12

7

1, 3, 5, 9, 11, 13,

14

Dynamic Burn-In

(Note 1)

-

7

14

2, 4, 6, 8, 10, 12 1, 3, 5, 9, 11, 13

Irradiation

(Note 2)

2, 4, 6, 8, 10, 12

7

1, 3, 5, 9, 11, 13,

14

NOTES:

1. Each pin except VDD and GND will have a series resistor of 10K

 5%, VDD = 18V  0.5V

2. Each pin except VDD and GND will have a series resistor of 47K

5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,

VDD = 10V

 0.5V

Typical Performance Characteristics

FIGURE 2. MINIMUM AND MAXIMUM VOLTAGE TRANSFER

CHARACTERISTICS

FIGURE 3. TYPICAL VOLTAGE TRANSFER CHARACTERIS-

TICS AS A FUNCTION OF TEMPERATURE

AMBIENT TEMPERATURE (TA) = +25oC

VI

VO

SUPPLY VOLTAGE

(VDD) = 15V

10V

5V

15.0

12.5

10.0

7.5

5.0

2.5

0

2.5

5.0

7.5

10.0

12.5

15.0

INPUT VOLTAGE (VI) (V)

SUPPLY VOLTAGE

(VDD) = 15V

10V

5V

15.0

12.5

10.0

7.5

5.0

2.5

0

2.5

5.0

7.5

10.0 12.5 15.0

INPUT VOLTAGE (VI) (V)

17.5

17.5 20.0

-55oC

-55oC

-55oC

+125oC

AMBIENT TEMPERATURE (TA)

= +125oC