Figure 33. Solder profile

Note:

The component should be limited to a maximum of three passes through this solder profile.

Note:

As the VL53L8CX package is not sealed, only a dry reflow process should be used (such as convection reflow).

Vapor phase reflow is not suitable for this type of optical component.

Note:

The VL53L8CX is an optical component and as such, it should be treated carefully. This typically includes using

a ‘no-wash’ assembly process.

9.6

Handling and storage precautions

9.6.1

Recommended solder pad dimensions

Figure 34. Recommended solder pattern

VL53L8CX

Handling and storage precautions

DS14161 - Rev 2

page 35/42