BC69PAS_SER

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Nexperia B.V. 2015. All rights reserved.

Product data sheet

Rev. 1 — 19 June 2015

4 of 15

Nexperia

BC69PAS series

20 V, 2 A PNP medium power transistors

6.

Thermal characteristics

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.

[4]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.

[5]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Max

Unit

Rth(j-a)

thermal resistance from junction to ambient

in free air

[1] 298

K/W

[2] 151

K/W

[3] 114

K/W

[4] 154

K/W

[5] 76

K/W

Rth(j-sp)

thermal resistance from junction to solder point

in free air

20

K/W

FR4 PCB, single-sided copper, tin-plated and standard footprint

Fig 2.

Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values