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EFP01 датащи(PDF) 37 Page - Silicon Laboratories

номер детали EFP01
подробное описание детали  EFP01 Energy Friendly PMIC Family
PDF  158 Pages
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производитель  SILABS [Silicon Laboratories]
домашняя страница  http://www.silabs.com
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EFP01 датащи(HTML) 37 Page - Silicon Laboratories

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5.1.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-
bility data, see the Quality and Reliability Monitor Report at https://www.silabs.com/about-us/corporate-responsibility/commitment-to-
quality.
Table 5.1. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Storage temperature range
TSTG
-50
150
°C
DC voltage on input supply
pins VDDA1
VVDDA
-0.3
2.0
V
DC voltage on input supply
pins VDDB1
VVDDB_DC
-0.3
5.5
V
Transient voltage on input
supply pin VDDB1
VVDDB_TRN
t < 30 µs, duty cycle < 0.01%
6.5
V
DC voltage connected
through inductor to LA2 pin
in boost configurations.1
VVBOOST
-0.3
5.5
V
Voltage on output supply
pins: VOA, VOB, VOC,
VOA_SW
VOUT
-0.3
5.5
V
DC voltage on VIO supply
pin
VVIO
-0.3
5.5
V
DC voltage on any I/O pin
VDIGPIN
-0.3
VVIO+0.3
V
On-chip power dissipation2
PDIS
2-layer PCB, THETAJA = 81.2
°C/W, TAMBIENT = 25 °C
923
mW
4-layer PCB, THETAJA = 66.0
°C/W, TAMBIENT = 25 °C
1136
mW
Operating Junction tempera-
ture
TJ
-G grade devices
-40
105
°C
Note:
1. Note that there is no reverse battery insertion protection implemented on-chip. Applications that may be susceptible to a reverse
battery insertion should incorporate external protection circuitry.
2. Max on-chip power dissipation is given by: PMAX = (100 °C - TAMBIENT) / THETAJA
EFP01 Energy Friendly PMIC Family Data Sheet
Electrical Specifications
silabs.com | Building a more connected world.
Rev. 1.3 | 37



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