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LPC55S2X датащи(PDF) 39 Page - NXP Semiconductors

номер детали LPC55S2X
подробное описание детали  32-bit Arm Cortex®-M33, CASPER, 256 KB SRAM; 512 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
PDF  140 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC55S2X датащи(HTML) 39 Page - NXP Semiconductors

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LPC55S2x/LPC552x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2022. All rights reserved.
Product data sheet
Rev. 2.2 — 8 December 2022
39 of 139
NXP Semiconductors
LPC55S2x/LPC552x
32-bit ARM Cortex-M33 microcontroller
[6] Transparent analog pad.
[7] Optional bypass mode is supported, xtal32M_P can be driven by an external clock with restrictions in terms of drive level. See: Section
13 “Application information”.
[8] The corresponding VBUS must be connected to supply voltage when using the USB peripheral. USB0_VBUS is not 5 V tolerant pin and
is tolerant up to 3.6 V only when the VDD is at operating level (minimum: 1.8 V). USB1_VBUS is 5 V tolerant pin regardless if the VDD
supply is present or not.
[9] Main battery supply: Star connection at application level (PCB)..
[10] If the USB1_3V3 pin is not using the same supply as the VBAT_PMU pin, the application should ensure the supply on USB1_3V3 does
not drop below 2.8 V. If the USB1_3V3 pin is using separate supply and this voltage unexpectedly drops below 2.8 V, the USB PHY can
go into unknown state causing USB transactions (R/W) to hang. In this case, the application can detect this event with a time-out and
would have to recover by performing a USB reset.
[11] The JTAG functions TRST, TCK, TMS, TDI, and TDO are selected by hardware when the part is in boundary scan mode. The JTAG
functions cannot be used for debug mode.
[12] Optional bypass mode is supported, xtal32K_P can be driven by an external clock with restrictions in terms of drive level See: Section
13 “Application information”.



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