GS816272CC-333/300/250/200/150

Preliminary

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Rev: 1.01 2/2005

29/31

© 2004, GSI Technology

209 BGA Package Drawing (Package C)

14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array

Symbol

Min

Typ

Max

Units

Symbol

Min

Typ

Max

Units

A

—

—

1.70

mm

D1

—

18.0 (BSC)

—

mm

A1

0.40

0.50

0.60

mm

E

13.9

14.0

14.1

mm

∅b

0.50

0.60

0.70

mm

E1

—

10.0 (BSC)

—

mm

c

0.31

0.36

0.38

mm

e

—

1.00 (BSC)

—

mm

D

21.9

22.0

22.1

mm

aaa

—0.15—

mm

Rev 1.0

A

A1

C

∅b

e

e

D1

D

aaa

Bottom View

Side View