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ADRF5144BCCZN-R7 датащи(PDF) 5 Page - Analog Devices

номер детали ADRF5144BCCZN-R7
подробное описание детали  10 W Average, Silicon SPDT, Reflective Switch, 1 GHz to 20 GHz
PDF  12 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

ADRF5144BCCZN-R7 датащи(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5144
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 5 of 12
For recommended operating conditions, see Table 1 and Table 2.
Table 3. Absolute Maximum Ratings
Parameter
Rating
Supply Voltage
Positive
−0.3 V to +3.6 V
Negative
−3.6 V to +0.3 V
Digital Control Input Voltage
Voltage
−0.3 V to VDD + 0.3 V
Current
3 mA
RF Input Power, Dual Supply1 (VDD = 3.3 V, VSS =
−3.3 V, f = 1 GHz to 18 GHz, TCASE = 85°C)
Insertion Loss Path
Average
40.5 dBm
Pulsed
43.5 dBm
Peak
44.5 dBm
Hot Switching
37.5 dBm
RF Input Power, Single Supply1 (VDD = 3.3 V, VSS = 0
V, f = 1 GHz to 18 GHz, TCASE = 85°C)
Insertion Loss Path
Average
30.5 dBm
Pulsed
30.5 dBm
Peak
30.5 dBm
Hot Switching
24.5 dBm
RF Power Under Unbiased Condition (VDD, VSS = 0 V)
Input at RFC
30 dBm
Input at RFx
24 dBm
Temperature
Junction (TJ)
135°C
Storage
−65°C to +150°C
Reflow
260°C
1 For power derating over frequency, see Figure 2 and Figure 3.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
Only one absolute maximum rating can be applied at a time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
θJC is the junction to the case bottom (channel to package bottom)
thermal resistance.
Table 4. Thermal Resistance
Package Type
θJC1
Unit
CC-20-13
25
°C/W
1 θJC was determined by simulation under the following conditions: the heat
transfer is due solely to the thermal conduction from the channel through the
ground pad to the PCB, and the ground pad is held constant at the operating
temperature of 85°C.
POWER DERATING CURVES
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C
Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C



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