MPC5644BCAMMJ1 datasheet(109/116 Pages) NXP

109 / 116 page

Ordering information

MPC5646C Microcontroller DataSheet, Rev. 7

NXP Semiconductors

109

Ordering information

Figure 45. Commercial product code structure

Qualification Status

Power Architecture

Automotive Platform

Core Version

Flash Size (core dependent)

Product

Optional fields

MPC56

Example code:

Temperature spec.

Package Code

Qualification Status

M = MC status

S = Auto qualified

P = PC status

PC = Power Architecture

Automotive Platform

56 = Power Architecture in 90 nm

Core Version

4 = e200z4d core version (highest core version in the case

of multiple cores)

Flash Memory Size

4 = 1.5 MB

5 = 2 MB

6 = 3 MB

Product Version

B = Body

C = Gateway

Optional fields

C = CSE module available

Blank = none of these options available

Fab and Mask Indicator

F = ATMC Fab

K = TSMC Fab

A = ATMC Fab or TSMC Fab

Second digit usually differentiate mask rev

Temperature spec.

C = –40 °C to 85 °C

V = –40 °C to 105 °C

M = –40 °C to 125 °C

R = Tape & Reel (blank if Tray)

Package Code

LU = 176 LQFP

LT = 208 LQFP

MJ = 256 MAPBGA

CPU Frequency

1 = e200z4d operates up to 120 MHz

8 = e200z4d operates up to 80 MHz

Shipping Method

R = Tape and reel

Blank = Tray

CPU Frequency

Fab and mask indicator

Note: Not all options are available on all devices. Refer to

Table 1, which shows the orderable part numbers for

MPC564xx.

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