PT2000 datasheet(12/148 Pages) NXP

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NXP Semiconductors

PT2000

VVSENSEN1/2/3

DC voltage at VSENSEN1/2/3

• Static at VCC5 < 10 V

• Dynamic for max 5.0

μs, 1.0 kHz repetition rate at VCC5, 5.25 V

• Dynamic for max 1.0

μs at VCC5 < 5.25 V

-1.0

-5.0

-15

1.0

5.0

—

(6)

VVSENSEP1/2/3

DC voltage at VSENSEP1/2/3

• DC voltage at VCC5 < 10 V

• Dynamic for max 5.0

μs, 1.0 kHz repetition rate at VCC5 < 5.25 V

• Dynamic for max 1.0

μs at VCC5 < 5.25 V

-2.5

-5.0

-15

2.5

5.0

—

(6)

VVSENSEN5/6

DC voltage at VSENSEN5/6

• DC voltage at VCC5 < 10 V

• Dynamic for max 5.0

μs, 1.0 kHz repetition rate at VCC5 < 5.25 V

• Dynamic for max 1.0

μs at VCC5 < 5.25 V

-3.0

-5.0

-15

1.0

5.0

—

(6)

VVSENSEP5/6

DC voltage at VSENSEP5/6

• DC voltage at VCC5 < 10 V

• Dynamic for max 5.0

μs, 1.0 kHz repetition rate at VCC5 < 5.25 V

• Dynamic for max 1.0

μs at VCC5 < 5.25 V

-4.2

-5.0

-15

2.5

5.0

—

(6)

ESD voltage

VESD-HBM1

VESD-HBM2

VESD-HBM3

VESD-CDM1

VESD-CDM2

ESD voltage

• Human body model (HBM)

VBOOST, VBATT, S_HSx

D_LSx

All other pins

• Machine model

Corner pins

All other pins

-4000

-8000

-2000

-750

-500

4000

8000

2000

750

500

(7), (8)

Thermal ratings

Operating temperature

• Ambient

• Junction

-40

125

150

°C

TTHRESHOLD

Temperature monitoring threshold

167

187

°C

TSTG

Storage ambient temperature

-55

150

°C

Thermal resistance

RθJA

Thermal resistance junction to ambient

—

25.3

°C/W

(9)

RθJCTOP

Thermal resistance junction to case top

—

13.2

°C/W

(10)

RθJCBOTTOM

Thermal resistance junction to case bottom

—

0.8

°C/W

(11)

Notes

With series resistor of 3.3 k

Ω ±20% at the pin

Guaranteed by design.

Human body model (HBM) per JESD22-A114 - 100 pF, 1.5 k

Charge device model (CDM) per JESD22-C101.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal

10.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC - 883 Method 1012.1).

11.

Thermal resistance between the die and the solder pad on the bottom of the package based on the simulation without internal resistance

Table 4. Maximum ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage

to the device.

Symbol

Ratings

Min.

Max.

Unit

Notes

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