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2019 - 2022 Microchip Technology Inc.

DS20006223B-page 21

MIC33153

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2018 Microchip Technology Inc.

X1

Y1

G2

Y3

G2

Y4

X2

G3

C

EV

Y2

G2

ØV

X3

G4

E

Dimension Limits

Units

Exposed Pad Width

Exposed Pad Length

Contact Pitch

Y2

X2

1.80

1.33

MILLIMETERS

0.50 BSC

MIN

E

MAX

Contact Pad Length (Xnn)

Y1

0.55

NOM

C

Contact Pad Spacing

2.80

Contact Pad to Contact Pad

G1

0.25

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

Contact Pad to Exposed Pad

G2

0.23

Y4

Exposed Pad Length

0.82

Y3

Exposed Pad Length

0.22

Contact Pad Width (Xnn)

X1

0.25

Exposed Pad Width

X3

1.25

Package Center to Exposed Pad

G3

0.17

Package Center to Exposed Pad

G4

0.38

G1

RECOMMENDED LAND PATTERN

SILK SCREEN

Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2

14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN]

With 1.33x1.80 Exposed Pad and Fused Terminals