VITESSE

SEMICONDUCTOR CORPORATION

Preliminary Datasheet

VSC7217

Mutli-Gigabit Interconnect Chip

Page 36

© VITESSE SEMICONDUCTOR CORPORATION

741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896

6/14/00

G52325-0, Rev. 3.0

Ordering Information

The part number for this product is formed by a combination of the device number and the package style:

Marking Information

The package is marked with three lines of text as shown:

Notice

This document contains information about a new product during its fabrication or sampling phase of devel-

opment. The information in this document is based on design targets, simulation results or early prototype test

results. Characteristic data and other specifications are subject to change without notice. Therefore the reader is

cautioned to confirm that this data sheet is current prior to design or order placement.

Warning

Vitesse Semiconductor Corporation’s products are not intended for use in life support appliances, devices

or systems. Use of a Vitesse product in such applications without the written consent is prohibited.

VSC7217

xx

Device Type

Package

UC: 256-Pin, 27mm BGA

Multi-Gigabit Interconnect Chip

VSC7217UC

####AAAA

Part Number

Package Suffix

Lot Tracking Code

Pin 1 Identifier

VITESSE

Date Code