A

A

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PACKAGE OUTLINE

C

16X

0.3

0.2

1.66 0.1

16X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

12X 0.5

4X

1.5

0.1 MIN

A

3.1

2.9

B

3.1

2.9

(0.05)

VQFN - 1 mm max height

RGT0016J

PLASTIC QUAD FLATPACK - NO LEAD

4224573/B 11/2018

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

4

9

12

5

8

16

13

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

SYMM

SYMM

17

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.600

A-A 40

SECTION A-A

TYPICAL

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INA851

SBOS999 – MARCH 2022

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