7.4 Thermal Information

THERMAL METRIC(1)

INA851

UNIT

RGT (VQFN)

16 PINS

Junction-to-ambient thermal resistance

47.3

°C/W

Junction-to-case (top) thermal resistance

53.6

°C/W

Junction-to-board thermal resistance

22.0

°C/W

Junction-to-top characterization parameter

1.4

°C/W

Junction-to-board characterization parameter

22.0

°C/W

Junction-to-case (bottom) thermal resistance

7.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Electrical Characteristics

otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

INPUT

Input stage offset

voltage(1) (4)

±10

±35

µV

±75

Input stage offset voltage

drift(1) (4)

±0.1

±0.4

µV/°C

Output stage offset

voltage(1) (4)

G = 0.2

±150

µV

TBD

G = 1

±150

TBD

Output stage offset

voltage drift(1) (4)

G = 0.2

±5

µV/°C

G = 1

±5

PSRR

Power-supply rejection

ratio

G = 0.2

100

dB

G = 1

110

G = 10

120

G = 100

126

G = 1000

130

Differential impedance

1 || 7

GΩ || pF

Common-mode

impedance

TBD || TBD

GΩ || pF

RFI filter –3 dB frequency

TBD

MHz

Common-mode input

voltage(5)

V

Protected input voltage

range

V

Input current in

overvoltage mode(8)

22

mA

CMRR

Common-mode rejection

ratio

At dc to 60 Hz, RTI,

G = 0.2

76

dB

G = 1

86

G = 10

106

G = 100

120

G = 1000

120

INA851

SBOS999 – MARCH 2022

www.ti.com

6

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: INA851