NXP Semiconductors

MF3D(H)x2

MIFARE DESFire EV2 contactless multi-application IC

MF3Dx2_MF3DHx2_SDS

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© NXP B.V. 2019. All rights reserved.

Product short data sheet

Rev. 3.2 — 12 June 2019

COMPANY PUBLIC

364232

9 / 27

Type number

Package

Description

Version

MF3DA200DU15/02

FFC

12 inch wafer (sawn; 150 μm thickness)[1][2]; 32 K NV, 17 pF input

capacitance

-

MF3DH9200DU15/02 FFC

12 inch wafer (sawn; 150 μm thickness)[1][2]; 16 K NV, 70 pF input

capacitance

-

MF3DHA200DU15/02 FFC

12 inch wafer (sawn; 150 μm thickness)[1][2]; 32 K NV, 70 pF input

capacitance

-

MF3D9200DU75/02

FFC

12 inch wafer (sawn; 75 μm thickness)[1][2]; 16 K NV, 17 pF input

capacitance

-

MF3DA200DU75/02

FFC

12 inch wafer (sawn; 75 μm thickness)[1][2]; 32 K NV, 17 pF input

capacitance

-

MF3DH9200DU75/02 FFC

12 inch wafer (sawn; 75 μm thickness)[1][2]; 16 K NV, 70 pF input

capacitance

-

MF3DHA200DU75/02 FFC

12 inch wafer (sawn; 75 μm thickness)[1][2]; 32 K NV, 70 pF input

capacitance

-

MF3D9200DA4/02

MOB4

plastic leadless module carrier package; 16 K NV, 17 pF input

capacitance

SOT500-2

MF3DA200DA4/02

MOB4

plastic leadless module carrier package; 32 K NV, 17 pF input

capacitance

SOT500-2

MF3DH9200DA4/02

MOB4

plastic leadless module carrier package; 16 K NV, 70 pF input

capacitance

SOT500-2

MF3DHA200DA4/02

MOB4

plastic leadless module carrier package; 32 K NV, 70 pF input

capacitance

SOT500-2

MF3D9200DA6/02

MOB6

plastic leadless module carrier package; 16 K NV, 17 pF input

capacitance

SOT500-3

MF3DA200DA6/02

MOB6

plastic leadless module carrier package; 32 K NV, 17 pF input

capacitance

SOT500-3

MF3DH9200DA6/02

MOB6

plastic leadless module carrier package; 16 K NV, 70 pF input

capacitance

SOT500-3

MF3DHA200DA6/02

MOB6

plastic leadless module carrier package; 32 K NV, 70 pF input

capacitance

SOT500-3

[1]

Delivered on film frame carrier with electronic failed die marking according to SECSII format.

[2]

See [2]