MF3DX2 datasheet(4/27 Pages) NXP

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NXP Semiconductors

MF3D(H)x2

MIFARE DESFire EV2 contactless multi-application IC

MF3Dx2_MF3DHx2_SDS

All information provided in this document is subject to legal disclaimers.

Product short data sheet

Rev. 3.2 — 12 June 2019

COMPANY PUBLIC

364232

4 / 27

2.1.5 New features on MIFARE DESFire EV2

• MIsmartApp (Delegated Application Management)

• Memory reuse in DAM applications (Format Application)

• Transaction MAC on application level

• Multiple Key Sets per application with fast key rolling mechanism (up to 16 sets)

• Accessing files from any two applications during a single transaction

• Multiple keys assignments for each file access right (up to 8)

• Virtual Card Architecture for enhanced card/application selection on multi-VC devices

with privacy protection

• Proximity Check for protection against Relay Attacks

• Originality Check for proof of genuine NXP’s product

• New EV2 Secure Messaging based on AES (similar with MIFARE Plus’s secure

messaging)

2.1.6 ISO/IEC 7816 compatibility

• Supports ISO/IEC 7816-4 file structure (selection by File ID or DF name)

• Supports ISO/IEC 7816-4 APDU message structure

• Supports ISO/IEC 7816-4 APDU wrapper for MIFARE DESFire native commands

• Supports ISO/IEC 7816-4 INS code ‘A4’ for SELECT FILE

• Supports ISO/IEC 7816-4 INS code ‘B0’ for READ BINARY

• Supports ISO/IEC 7816-4 INS code ‘D6’ for UPDATE BINARY

• Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS

• Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD

• Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE

• Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE

• Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE

2.1.7 Special features

• Transaction-oriented automatic anti-tear mechanism

• Configurable ATS information for card personalization

• Backward compatibility mode to MIFARE DESFire EV1 and D40 (MF3ICD40)

• Optional high input capacitance (70 pF) for small form factor designs (MF3DHx2)

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