NXP Semiconductors

MF3D(H)x2

MIFARE DESFire EV2 contactless multi-application IC

MF3Dx2_MF3DHx2_SDS

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© NXP B.V. 2019. All rights reserved.

Product short data sheet

Rev. 3.2 — 12 June 2019

COMPANY PUBLIC

364232

8 / 27

5 Ordering information

Table 3. Ordering information

Type number

Package

Description

Version

MF3D8201DUD/01

FFC

8 inch wafer (sawn; 120 μm thickness)[1][2]; 8 K NV, 17 pF input

capacitance

-

MF3D4201DUD/01

FFC

8 inch wafer (sawn; 120 μm thickness)[1][2]; 4 K NV, 17 pF input

capacitance

-

MF3D2201DUD/01

FFC

8 inch wafer (sawn; 120 μm thickness)[1][2]; 2 K NV, 17 pF input

capacitance

-

MF3DH8201DUD/01 FFC

8 inch wafer (sawn; 120 μm thickness)[1][2]; 8 K NV, 70 pF input

capacitance

-

MF3DH4201DUD/01 FFC

8 inch wafer (sawn; 120 μm thickness)[1][2]; 4 K NV, 70 pF input

capacitance

-

MF3DH2201DUD/01 FFC

8 inch wafer (sawn; 120 μm thickness)[1][2]; 2 K NV 70 pF input

capacitance

-

MF3D8201DUF/01

FFC

8 inch wafer (sawn; 75 μm thickness)[1][2]; 8 K NV, 17 pF input

capacitance

-

MF3D4201DUF/01

FFC

8 inch wafer (sawn; 75 μm thickness)[1][2]; 4 K NV, 17 pF input

capacitance

-

MF3D2201DUF/01

FFC

8 inch wafer (sawn; 75 μm thickness)[1][2]; 2 K NV, 17 pF input

capacitance

-

MF3DH8201DUF/01

FFC

8 inch wafer (sawn; 75 μm thickness)[1][2]; 8 K NV, 70 pF input

capacitance

-

MF3DH4201DUF/01

FFC

8 inch wafer (sawn; 75 μm thickness)[1][2]; 4 K NV, 70 pF input

capacitance

-

MF3DH2201DUF/01

FFC

8 inch wafer (sawn; 75 μm thickness)[1][2]; 2 K NV, 70 pF input

capacitance

-

MF3D8200DA4/01

MOA4

plastic leadless module carrier package; 8 K EE, 17 pF input capacitance SOT500-2

MF3D4200DA4/01

MOA4

plastic leadless module carrier package; 4 K EE, 17 pF input capacitance SOT500-2

MF3D2200DA4/01

MOA4

plastic leadless module carrier package; 2 K EE, 17 pF input capacitance SOT500-2

MF3DH8200DA4/01

MOA4

plastic leadless module carrier package; 8 K EE, 70 pF input capacitance SOT500-2

MF3DH4200DA4/01

MOA4

plastic leadless module carrier package; 4 K EE, 70 pF input capacitance SOT500-2

MF3DH2200DA4/01

MOA4

plastic leadless module carrier package; 2 K EE, 70 pF input capacitance SOT500-2

MF3D8200DA6/01

MOB6

plastic leadless module carrier package; 8 K EE, 17 pF input capacitance SOT500-3

MF3D4200DA6/01

MOB6

plastic leadless module carrier package; 4 K EE, 17 pF input capacitance SOT500-3

MF3D2200DA6/01

MOB6

plastic leadless module carrier package; 2 K EE, 17 pF input capacitance SOT500-3

MF3DH8200DA6/01

MOB6

plastic leadless module carrier package; 8 K EE, 70 pF input capacitance SOT500-3

MF3DH4200DA6/01

MOB6

plastic leadless module carrier package; 4 K EE, 70 pF input capacitance SOT500-3

MF3DH2200DA6/01

MOB6

plastic leadless module carrier package; 2 K EE, 70 pF input capacitance SOT500-3

MF3D9200DU15/02

FFC

12 inch wafer (sawn; 150 μm thickness)[1][2]; 16 K NV, 17 pF input

capacitance

-