MCT8316Z datasheet(2/100 Pages) TI

2 / 100 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table ..............................................3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 7

7.1 Absolute Maximum Ratings........................................ 7

7.2 ESD Ratings AUTO.................................................... 7

7.3 Recommended Operating Conditions.........................7

7.4 Thermal Information....................................................8

7.5 Electrical Characteristics.............................................8

7.6 SPI Timing Requirements......................................... 15

7.7 SPI Secondary Device Mode Timings.......................16

7.8 Typical Characteristics.............................................. 16

8 Detailed Description......................................................17

8.1 Overview................................................................... 17

8.2 Functional Block Diagram......................................... 18

8.3 Feature Description...................................................20

8.4 Device Functional Modes..........................................58

8.5 SPI Communication.................................................. 59

8.6 Register Map.............................................................62

9 Application and Implementation.................................. 77

9.1 Application Information............................................. 77

9.2 Hall Sensor Configuration and Connection...............78

9.3 Typical Applications.................................................. 82

10 Power Supply Recommendations..............................87

10.1 Bulk Capacitance.................................................... 87

11 Layout........................................................................... 88

11.1 Layout Guidelines................................................... 88

11.2 Layout Example...................................................... 89

11.3 Thermal Considerations.......................................... 90

12 Device and Documentation Support..........................91

12.1 Documentation Support.......................................... 91

12.2 Support Resources................................................. 91

12.3 Trademarks.............................................................91

12.4 Electrostatic Discharge Caution..............................91

12.5 Glossary..................................................................91

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE

REVISION

NOTES

December 2021

Initial Release

MCT8316Z-Q1

SLVSGO3 – DECEMBER 2021

www.ti.com

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