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SPC58ECX датащи(PDF) 144 Page - STMicroelectronics

номер детали SPC58ECX
подробное описание детали  SPC58 C Line - 32 bit Power Architecture automotive MCU Dual z4 cores 180 MHz, 4 MBytes Flash, HSM, ASIL-B
PDF  153 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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Revision history
SPC584Cx, SPC58ECx
144/153
DS11620 Rev 8
24-Mar-2017
3
(cont’d)
Section 4: Package information
: Updated
– Table 65: eTQFP64 package mechanical data
– Figure 47: eTQFP64 package outline
– Table 66: eTQFP100 package mechanical data
Section 5.6: Package thermal characteristics
:
Table 74: Thermal characteristics for 64 exposed pad eTQFP package, Table 75:
Thermal characteristics for 100 exposed pad eTQFP package,Table 76: Thermal
characteristics for 144 exposed pad eTQFP package,Table 77: Thermal
characteristics for 176 exposed pad LQFP package
:
Updated the following parameter values with External and Internal ballast values:
RθJA
RθJB
RθJCtop
RθJCbottom
ΨJT
Removed parameter “
RθJMA
Table 78: Thermal characteristics for 292-pin FPBGA:
External ballast value updated for the following parameters:
RθJA
RθJB
RθJC
ΨJT
Removed parameter “
RθJMA”.
Chapter 5: Ordering information
:
Figure 64: Commercial product scheme
:
– Core option “4” updated from “Single computing e200z4 core” to “Single
computing e200z4 core(CPU_2)”
– Core option “E” updated from “Dual computing e200z4 core” to “Dual computing
e200z4 core(CPU_2+CPU_0)”
Added new tables:
– Table 79: Code Flash Options FOTA (KByte)
– Table 81: RAM options
Changed Microsoft Excel® workbook attached to this document (was
SPC584Cx_SPC58ECx_IO_Definition_v5.xlsx dated 14 April 2016).
For details, refer to the sheet Revision History of the attached file
“SSPC584Cx_SPC58ECx_IO_Definition_v6.xlsx”.
Table 82. Document revision history (continued)
Date
Revision
Changes



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