SPC58ECX datasheet(131/153 Pages) STMICROELECTRONICS

131 / 153 page

DS11620 Rev 8

131/153

SPC584Cx, SPC58ECx

Package information

135

5.6.3

eTQFP144

RθJB

Junction-to-board(3)

External Ballast

9.5

°C/W

Internal Ballast

12.7

RθJCtop

Junction-to-case top(4)

External Ballast

8.6

°C/W

Internal Ballast

11.9

RθJCbottom CC D

Junction-to-case bottom(5)

External Ballast

°C/W

Internal Ballast

ΨJT

Junction-to-package top(6)

Natural convection

(External Ballast)

°C/W

Internal Ballast

3.6

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 75. Thermal characteristics for 100 exposed pad eTQFP package (continued)

Symbol

Parameter(1)

Conditions

Value

Unit

Table 76. Thermal characteristics for 144 exposed pad eTQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection(2)

Four layer board (2s2p)

(External Ballast)

25.5

°C/W

Four layer board (2s2p)

(Internal Ballast)

28.2

RθJB

Junction-to-board(3)

External Ballast

10.2

°C/W

Internal Ballast

13.4

RθJCtop

Junction-to-case top(4)

External Ballast

8.7

°C/W

Internal Ballast

RθJCbottom CC D

Junction-to-case bottom(5)

External Ballast

°C/W

Internal Ballast

ΨJT

Junction-to-package top(6)

Natural convection

(External Ballast)

°C/W

Natural convection

(Internal Ballast)

3.6

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