SPC58ECX datasheet(130/153 Pages) STMICROELECTRONICS

130 / 153 page

Package information

SPC584Cx, SPC58ECx

130/153

DS11620 Rev 8

5.6

Package thermal characteristics

The following tables describe the thermal characteristics of the device. The parameters in

this chapter have been evaluated by considering the device consumption configuration

reported in the Section 4.7: Device consumption.

5.6.1

eTQFP64

5.6.2

eTQFP100

Table 74. Thermal characteristics for 64 exposed pad eTQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection(2)

Four layer board (2s2p)

(External Ballast)

26.1

°C/W

Four layer board (2s2p)

(Internal Ballast)

28.6

RθJB

Junction-to-board(3)

External Ballast

6.9

°C/W

Internal Ballast

9.9

RθJCtop

Junction-to-case top(4)

External Ballast

8.6

°C/W

Internal Ballast

11.8

RθJCbottom CC D

Junction-to-case bottom(5)

External Ballast

°C/W

Internal Ballast

ΨJT

Junction-to-package top(6)

Natural convection

(External Ballast)

°C/W

Natural convection

(Internal Ballast)

3.6

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

5. Thermal resistance between the die and the exposed pad ground on the bottom of the package based on simulation

without any interface resistance.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

Table 75. Thermal characteristics for 100 exposed pad eTQFP package

Symbol

Parameter(1)

Conditions

Value

Unit

RθJA

D Junction-to-Ambient, Natural Convection(2)

Four layer board (2s2p)

(External Ballast)

25.8

°C/W

Four layer board (2s2p)

(Internal Ballast)

28.5

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