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MIC2182 датащи(PDF) 6 Page - Microchip Technology |
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MIC2182 датащи(HTML) 6 Page - Microchip Technology |
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6 / 40 page ![]() MIC2182 DS20006644A-page 6 2022 Microchip Technology Inc. and its subsidiaries SYNC Threshold Level VSYNC_TH 0.7 1.3 1.9 V — SYNC Input Current ISYNC — 0.1 5 µA VSYNC = 5V SYNC Minimum Pulse Width tSYNC(MIN) 200 — — ns — SYNC Capture Range fSYNC 330 — — kHz Note 2 Frequency Foldback Threshold VFOLD_TH 0.75 0.95 1.15 V Measured at VOUT Pin Foldback Frequency fFOLD — 60 — kHz — Gate Drivers Rise/Fall Time tR, tF — 60 — ns CLOAD = 3000 pF Output Driver Impedance RON_H — 5 8.5 Ω Source RON_L — 3.5 6 Sink Driver Non-overlap Time tNON — 80 — ns — PWM Input PWM Input Source Current IPWM_SRC — –10 — µA VPWM = 0V 1: VIN > 1.3 x VOUT (for the feedback voltage reference and output voltage line and total regulation). 2: See the Oscillator and Sync section for limitations on the synchronizing signal frequency. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Ambient Storage Temperature Range TS –65 — +150 °C — Ambient Temperature Range TA –40 — +85 °C — Junction Temperature Range TJ –40 — +125 °C — Package Thermal Resistances Thermal Resistance SOIC 16-Ld JA — 100 — °C/W — Thermal Resistance SSOP 16-Ld JA — 150 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = 15V; SS = Open; VSHDN = 5V; ILOAD = 0.1A, TA = +25°C, Bold values indicate –40°C ≤ TA ≤ +85°C; unless otherwise specified. Parameter Symbol Min. Typ. Max. Units Conditions |
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